| Thaisarco
produces solder powders
according to the following specifications using
ultrasonic technology. All our solder powders
meet or exceed the standards of International
specifications.
Alloy Composition
Thaisarco alloyed solder powders
are produced using high purity alloys. Table
1. illustrates the range of alloy compositions
Thaisarco can produce although
this range is not exhaustive. Other alloy compositions
can be supplied with melting points up to 320
degC. Please contact Thaisarco if you have any
requirement for an alloy within this melting
point range.
Alloy |
Melting Point Range degC |
Sn63/Pb37 |
183 |
Sn60/Pb40 |
183-188 |
Sn43/Bi57 |
138 |
Sn96/Ag4 |
221 |
Sn99/Cu1 |
227 |
SAC 305 |
218 |
Particle
Size
Thaisarco alloyed solder
powders are available in type 2, type 3 and
type 4 grades. The particle size distributions
meet or exceed the J-STD-006 specification shown
in Table 2. Other particle size distributions
can be provided to meet individual customer’s
requirements.
Grade |
1%
less than |
90% |
10%
max. |
Type 2 |
+75 microns |
75-45 micron |
45 micron |
Type 3 |
+45 microns |
45-25 micron |
25 micron |
Type 4 |
+38 microns |
38-20 micron |
20 micron |
Oxygen
Content
Thaisarco alloyed solder
powders are manufactured under strict procedures
to ensure controlled oxygen content. Typical
values are listed in Table 3.
Grade
|
Oxygen
Content |
Type 2 |
< 100
ppm |
Type 3 |
< 100
ppm |
Type 4 |
< 120 ppm |
Morphology
Thaisarco solder powders
are of spherical shape and free from surface
defects.
Packaging
Solder powders are normally
supplied in aluminium foil bags sealed under
inert gas.
Bags are packed in a high density polyethylene
pail. Alternate packaging is available to meet
customer’s requirements.
Storage and Shelf Life
Thaisarco solder powders
are packaged to ensure protection from air and
moisture. Care must be taken to minimize air
and high temperature exposure after opening
the package.
Thaisarco solder powders have
a shelf life of 6 months from date of manufacture,
for factory sealed bags, stored under room temperature
conditions.
Quality Assurance
Quality checks are made at various stages
of manufacture. It is standard procedure to
check the following properties on each batch
of solder powder produced.
• Composition
and purity levels
• Particle Size
Distribution measured by Beckman Coulter Laser
Particle Size Analyser
(Model No LS 13 320)
• Oxygen content
measured by LECO Analyser
• Particle Shape
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